JPS5887368U - 発光ダイオ−ド - Google Patents

発光ダイオ−ド

Info

Publication number
JPS5887368U
JPS5887368U JP18246881U JP18246881U JPS5887368U JP S5887368 U JPS5887368 U JP S5887368U JP 18246881 U JP18246881 U JP 18246881U JP 18246881 U JP18246881 U JP 18246881U JP S5887368 U JPS5887368 U JP S5887368U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
pellet
metal
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18246881U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236312Y2 (en]
Inventor
田代　嘉宣
箕輪　文雄
Original Assignee
日本インタ−ナシヨナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナシヨナル整流器株式会社 filed Critical 日本インタ−ナシヨナル整流器株式会社
Priority to JP18246881U priority Critical patent/JPS5887368U/ja
Publication of JPS5887368U publication Critical patent/JPS5887368U/ja
Application granted granted Critical
Publication of JPS6236312Y2 publication Critical patent/JPS6236312Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP18246881U 1981-12-08 1981-12-08 発光ダイオ−ド Granted JPS5887368U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS5887368U true JPS5887368U (ja) 1983-06-14
JPS6236312Y2 JPS6236312Y2 (en]) 1987-09-16

Family

ID=29980855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18246881U Granted JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5887368U (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Also Published As

Publication number Publication date
JPS6236312Y2 (en]) 1987-09-16

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